Stack type ball grid array package and method for...

Details Stack type ball grid array package and method for... Stack type ball grid array package and method for...

2011-05-10

2011-05-10

Blum, David S (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S738000, C257SE23069, C257SE25013, C438S109000

Reexamination Certificate

active

07939924

ABSTRACT:
A stacked BGA package and a method for manufacturing the stacked BGA package, with reduced size and/or height of a unit package, which may also reduce an electrical connection length. The stacked BGA package may include a base BGA package having at least one semiconductor chip, and a plurality of BGA packages which are stacked on the base BGA package. A plurality of solder balls may electrically connect the base BGA package and the plurality of BGA packages and may then be sealed to reduce the likelihood of damage.

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Machine Translation of KR2000-0056804.
Korean Office Action dated Sep. 30, 2005 with English translation.

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