Substrate, manufacturing method thereof, method for...

Details Substrate, manufacturing method thereof, method for... Substrate, manufacturing method thereof, method for...

2011-05-31

2011-05-31

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S737000, C257SE23068, C438S613000

Reexamination Certificate

active

07952208

ABSTRACT:
A substrate on which an IC element is fixed includes: a plurality of metal posts arranged in a plurality of columns in a lengthwise direction and in a plurality of rows in a crosswise direction when viewed in a plan view, the plurality of metal posts having first faces and second faces that face an opposite side to a side that the first faces face; first marks each of the first marks being disposed on extending lines of the plurality of columns; and second marks, each of the second marks being disposed on extending lines of the plurality of rows.

REFERENCES:
patent: 5847458 (1998-12-01), Nakamura et al.
patent: 6025650 (2000-02-01), Tsuji et al.
patent: 6498392 (2002-12-01), Azuma
patent: 6635957 (2003-10-01), Kwan et al.
patent: 7696082 (2010-04-01), Otsuki
patent: A-2-240940 (1990-09-01), None
patent: A-2004-281486 (2004-10-01), None
patent: A-2006-108343 (2006-04-01), None

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