Method of manufacturing semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S737000, C438S706000

Reexamination Certificate

active

07989331

ABSTRACT:
A method of manufacturing a semiconductor device including forming a mask layer on a polycrystalline silicon film formed on a semiconductor substrate via an insulating film; forming a dense pattern and a sparse pattern on the mask layer to form a mask; etching the polycrystalline silicon film with the mask by controlling a temperature of the semiconductor substrate placed in an etching chamber at 50 degrees Celsius or higher, supplying an etching gas composed of a hydrogen bromide containing gas and a fluoromethane based gas into the chamber, and generating plasma in the chamber.

REFERENCES:
patent: 5387556 (1995-02-01), Xiaobing et al.
patent: 5846443 (1998-12-01), Abraham
patent: 6194284 (2001-02-01), Chen
patent: 6491835 (2002-12-01), Kumar et al.
patent: 6500727 (2002-12-01), Chen et al.
patent: 6531349 (2003-03-01), Yoshida et al.
patent: 6653237 (2003-11-01), Deshmukh et al.
patent: 6709984 (2004-03-01), Saito et al.
patent: 6784110 (2004-08-01), Wen et al.
patent: 7259067 (2007-08-01), Yang
patent: 7312158 (2007-12-01), Miyagawa et al.
patent: 2001/0036732 (2001-11-01), Yoshida et al.
patent: 2002/0115276 (2002-08-01), Yoshida et al.
patent: 2003/0003752 (2003-01-01), Deshmukh et al.
patent: 2005/0095784 (2005-05-01), Yang
patent: 2005/0215062 (2005-09-01), Miyagawa et al.
patent: 2006/0216938 (2006-09-01), Miyagawa et al.
patent: 2007/0184657 (2007-08-01), Iijima et al.
patent: 2008/0085593 (2008-04-01), Miyagawa
patent: 2008/0230519 (2008-09-01), Takahashi
patent: 2004-64020 (2004-02-01), None
patent: 2005-268292 (2005-09-01), None
patent: 2006-86486 (2006-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2626752

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.