Thin film transistor and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S350000

Reexamination Certificate

active

07923780

ABSTRACT:
The present invention provides a step in which a channel-length of a TFT can be controlled with higher reproducibility. In addition, the present invention provides a step in which a short channel-length of the TFT can be manufactured. Further, the present invention provides a structure of the TFT in which a current-voltage characteristic can be improved. The present invention refers to a thin film transistor comprising a lamination layer wherein a first conductive film, a first insulating film and a second conductive film are sequentially laminated, a semiconductor film formed so as to be in contact with the side surface of the lamination layer, and a third conductive film covering the semiconductor film through a second insulating film. The first conductive film and the second conductive film are a source electrode and a drain electrode, and a region which is in contact with the first insulating film and the third conductive film is a channel forming region in semiconductor film, and the third conductive film is a gate electrode.

REFERENCES:
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patent: 4924279 (1990-05-01), Shimbo
patent: 4949141 (1990-08-01), Busta
patent: 7138682 (2006-11-01), Kamata et al.
patent: 2004/0029310 (2004-02-01), Bernds et al.
patent: 03-291973 (1991-12-01), None
patent: 2000-275678 (2000-10-01), None
patent: 2001-326356 (2001-11-01), None
patent: 2003-318407 (2003-11-01), None
patent: 2004-507096 (2004-03-01), None

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