Transfer material used for producing a wiring substrate

Details Transfer material used for producing a wiring substrate Transfer material used for producing a wiring substrate

2011-02-15

2011-02-15

Chambliss, Alonzo (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S758000, C257S786000, C438S622000, C029S876000

Reexamination Certificate

active

07888789

ABSTRACT:
A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.

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