Method for manufacturing semiconductor device

Details Method for manufacturing semiconductor device Method for manufacturing semiconductor device

2011-03-22

2011-03-22

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S597000, C438S612000

Reexamination Certificate

active

07910498

ABSTRACT:
A method for manufacturing a semiconductor device, including: (a) forming an energy cured resin layer on a semiconductor substrate having an electrode pad and a passivation film; (b) fusing the resin layer without being cured and shrunk by a first energy supply processing; (c) forming a resin boss by curing and shrinking the resin layer after fusion by a second energy supply processing; and(d) forming an electrical conducting layer which is electrically connected to the electrode pad and passes through over the resin boss.

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