Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-02-22
2011-02-22
Smith, Zandra (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S686000, C257S712000, C257S717000, C257SE23107, C257SE23108, C257S930000, C136S203000
Reexamination Certificate
active
07893529
ABSTRACT:
The invention comprises a 3D chip stack with an intervening thermoelectric coupling (TEC) plate. Through silicon vias in the 3D chip stack transfer electronic signals among the chips in the 3D stack, power the TEC plate, as well as distribute heat in the stack from hotter chips to cooler chips.
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A Novel VLSI Technology to Manufacture High-Density Thermoelectric Cooling Devices, Howard Chen, Louis Hsu, and Xiaojin Wei. ISBN: 978-2-35500-002-7, Therminic 2007 pp. 1-6, Budapest, Hungary, Sep. 17-19, 2007.
Hsu Louis Lu-Chen
Wang Ping-Chuan
Wei Xiaojin
Zhu Huilong
Brown Katherine S.
International Business Machines - Corporation
Joy Jeremy J
Smith Zandra
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