Method of fabricating structures

Details Method of fabricating structures Method of fabricating structures

2011-03-01

2011-03-01

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

C438S613000, C438S698000, C257SE29323

Reexamination Certificate

active

07897515

ABSTRACT:
A method of processing a stack, the method including depositing a fusible material on a first hardmask layer, the first hardmask layer disposed on a surface of a pre-processed stack, the pre-processed stack being disposed on at least a portion of a substrate; heating the fusible material layer to a temperature at or above its melting point to cause it to form a fusible material sphere, the fusible material sphere disposed on less than the entire first hardmask layer; etching the first hardmask layer, wherein the fusible material sphere prevents a portion of the first hardmask layer from etching, thereby forming a second hardmask layer; and etching the pre-processed stack, wherein at least the second hardmask layer prevents a portion of the pre-processed stack from etching, thereby forming a stack.

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K.F. Harsh, V.M. Bright and Y.C. Lee, University of Colorado, Boulder “Study of Micro-Sale Limits of Solder Self-Assembly for MEMS”, 2000 Electronic Components and Technology Conference.

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