Process for forming refractory metal layers on ceramic substrate

Details Process for forming refractory metal layers on ceramic substrate Process for forming refractory metal layers on ceramic substrate

1981-03-20

1982-07-20

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29851, 264 61, 427 98, 427 99, 427124, 427125, 4273763, 4273835, H05K 312

Patent

active

043406181

ABSTRACT:
A process for forming a substantially glass free surface on screened refractory metallurgy areas on a ceramic substrate wherein a thin layer of Pd is deposited over the metallurgy areas and the metallurgy areas subsequently sintered causing the surface refractory metal particles to be fused into a substantially solid metallurgy layer under the catalyzing influence of the Pd.

REFERENCES:
patent: 3518756 (1970-07-01), Bennett et al.
patent: 3978248 (1976-08-01), Usami
patent: 3999004 (1976-12-01), Chirno
patent: 4109377 (1978-08-01), Blazick et al.
Miller, "Metallization Paste Vehicle", IBM TDB, vol. 22, No. 4, Sep. 1979, p. 1435.
Kaiser et al., "A Fabrication Technique for Multilayer Ceramic Modules", Solid State Technology, May 1972.
Toth et al., "Activation Sintering of Tungsten", Journal of Less-Common Metals, vol. 19, pp. 157-167, (1965).
German et al., "Heterodiffusion Model for the Activated Sintering of Molybdenum", Journal of the Less-Common Metals, 58, 1978, 61-74.
Koopman, "Wettability Process", IBM TDB, vol. 17, No. 8, Jan. 1975, p. 2331.
Chance, "Green Ceramic Metallization", IBM TDB, vol. 12, No. 11, Apr. 1970, p. 1795.
Harvilchuck et al., "Cleaning Sintered Multilayer Ceramic Pad Surfaces for Plating", IBM TDB, vol. 19, No. 11, Apr. 1977, p. 415.
Haddad et al., "Activation of Catalyst for Electroless Plating on Molybdenum", IBM TDB, vol. 19, No. 3, Aug. 1976, p. 929.

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