Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-06-16
1994-04-19
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 163, 257707, 257796, 361776, H05K 720
Patent
active
053051793
ABSTRACT:
A semiconductor device includes a semiconductor chip mounted in a resin package body. A plurality of interconnection leads are provided on the resin package body along a lower edge thereof and project outwardly from the lower edge. A heat dissipation lead is connected to the resin package body for dissipating heat generated by the semiconductor chip. The heat dissipation lead includes a plate of a heat conducting material having a stage part and a heat sink part, wherein the stage part is held inside the resin package body and supports the semiconductor chip thereon. The heat sink part projects outwardly from the resin package body and includes a part that extends in a downward direction. The heat sink part has a lower edge that is formed at a level substantially flush with the outer lead part of the interconnection leads such that the semiconductor device is held upright, when placed on a substrate, by the outer lead part of the interconnection leads and by the lower edge of the heat sink part of the heat dissipation lead.
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Patent Abstracts of Japan, vol. 12, No. 146 (E-605) (2993) 6 May 1988 & JP-A-62 263 667 (Hitachi Tobu Semiconductor) 16 Nov. 1987 * abstract *.
Research Disclosure, No. 316, Aug. 1990, Havant GB, pp. 628-631; `Snap-On Heatsink Clamp` * paragraph 1-paragraph 3; FIG. 3 *.
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Kasai Junichi
Mitobe Kazuhiko
Saito Kouji
Sono Michio
Yoshimoto Masanori
Fujitsu Limited
Tolin Gerald P.
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