Manufacturing method for filling a trench or contact hole in a s

Details Manufacturing method for filling a trench or contact hole in a s Manufacturing method for filling a trench or contact hole in a s

1995-07-25

1998-10-20

Garrett, Felisa

Fishing, trapping, and vermin destroying

4272555, 4372286, 437288, H01L 21465

Patent

active

058245626

ABSTRACT:
There are disclosed an opening filling apparatus and a method for manufacturing a semiconductor device by using the same. An opening of a semiconductor device is filled by using the filling apparatus comprising: a chamber having a rotation shaft, a motor, a plurality of plates arranged in a circular form centering at the rotation shaft, and a heater; and means for injecting gas. When the opening of a semiconductor device such as a trench or a contact hole is filled, filling material may move down by using the centrifugal force generated by rotating the substrate, to thereby fill the opening completely without a void.

REFERENCES:
patent: 5093274 (1992-03-01), Kohno
patent: 5175125 (1992-12-01), Wong
patent: 5482893 (1996-01-01), Okabe et al.

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