Package structure having accessible chip

Details Package structure having accessible chip Package structure having accessible chip

1993-08-13

1996-02-13

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257675, 257676, 257680, 257684, 257687, 257713, 257714, H01L 2348, H01L 2302, H01L 2504, H01L 2944

Patent

active

054913624

ABSTRACT:
A package for an integrated-circuit includes a package body having a die-cavity formed therein. A die-attach pad is formed in the package body adjacent the die-cavity. An opening is formed in the central portion of the die-attach pad for exposing one side of the integrated-circuit die so that an external cooling media can directly contact the exposed side of the integrated-circuit die. The die-attach pad can be formed as a die-mounting ring adjacent the die-attach cavity. The peripheral edge of the integrated-circuit die is fixed to a mounting surface on the die-mounting ring portion to accommodate direct cooling of the exposed side of the integrated-circuit die. The mounting surface of the die-mounting ring extends beyond the peripheral edge of the integrated-circuit die to accommodate a range of sizes of the integrated-circuit die. The exposed surface of the integrated circuit die is cooled, for example, with a cooling fluid, a heatsink, or a thermo-electric refrigeration unit in contact with the exposed side of the die. The exposed side of the die is coated with a film to provide a seal for the exposed side of the integrated-circuit die.

REFERENCES:
patent: 3521128 (1970-07-01), Oates
patent: 4809053 (1989-02-01), Kuraishi
patent: 4876588 (1989-10-01), Miyamoto
patent: 4976588 (1989-10-01), Miyamoto
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.

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