Method of fabricating apertured deposition masks used for fabric

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156644, 156656, 156659, 428137, C23F 102

Patent

active

040861279

ABSTRACT:
An improved method of fabricating apertured deposition masks is disclosed, with the masks being used in the fabrication of thin film deposited electronic components such as transistors. The masks comprise a core portion with a metal layer provided on a relief side of the core and a metal layer provided on the defining side of the core. The relief side metal layer and the core of the mask are further resist delineated, selectively plated and etched differentially providing a mask preform in which the defining side metal layer is left intact. A narrow width radiation beam is then directed upon closely spaced portions of the defining side metal layer to selectively cut through the defining side metal layer providing the desired space apertures separated by a narrow bridge portion of the defining side metal layer.

REFERENCES:
patent: 3574012 (1971-04-01), Penberg
patent: 3668028 (1972-06-01), Short
patent: 3958255 (1976-05-01), Chiou et al.
patent: 4013502 (1977-03-01), Staples
patent: 4021276 (1977-05-01), Cho et al.

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