Micromechanical component with a dielectric movable structure, m

Details Micromechanical component with a dielectric movable structure, m Micromechanical component with a dielectric movable structure, m

1996-11-26

1998-10-20

Breneman, R. Bruce

Etching a substrate: processes

Etching of semiconductor material to produce an article...

438 53, 257417, 7351432, H01L 21306, H01G 700

Patent

active

058242333

ABSTRACT:
A micromechanical component includes a fixed micromechanical structure having a pair of capacitor plates being formed of one or more conductive layers, and a movable micromechanical structure being formed of a dielectric layer to be introduced into or removed from an interstice between the plates. A capacitance change is obtained through the resilient or freely movable dielectric, so that the component can be inserted as a proportional or a non-proportional force sensor. A microsystem with an integrated circuit and a micromechanical component with a movable dielectric, as well as a production method for the component and the microsystem, are also provided.

REFERENCES:
patent: 4530029 (1985-07-01), Beristain
patent: 4901586 (1990-02-01), Blake et al.
patent: 5332469 (1994-07-01), Mastrangelo

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