Semiconductor assembly with solder material layer and method for

Details Semiconductor assembly with solder material layer and method for Semiconductor assembly with solder material layer and method for

1997-02-19

1999-05-11

Krynski, William

Metal fusion bonding

Process

Preplacing solid filler

257508, 428642, 428643, 428656, 428661, H05K3/34

Patent

active

059019018

ABSTRACT:
In a semiconductor assembly with a solder material layer and a method for soldering the semiconductor assembly, a silicon semiconductor body with a diffusion barrier layer is provided with a solder material layer, preferably a tin layer. The semiconductor body is then applied to a metal carrier plate and is directly soldered to the carrier plate by heating to temperatures to above 250.degree. C., i.e. without further additions.

REFERENCES:
patent: 2474039 (1949-06-01), Davignon
patent: 4451972 (1984-06-01), Batinovich
patent: 4834794 (1989-05-01), Yagi et al.
patent: 5027189 (1991-06-01), Shannon et al.
patent: 5108027 (1992-04-01), Warner et al.
patent: 5405809 (1995-04-01), Nakamura et al.
patent: 5803343 (1998-09-01), Sarma et al.
patent: 5816478 (1998-10-01), Kaskoun et al.

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