Semiconductor unit with semiconductor device mounted with conduc

Details Semiconductor unit with semiconductor device mounted with conduc Semiconductor unit with semiconductor device mounted with conduc

1997-03-06

1998-12-01

Tran, Minh-Loan

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257779, 257781, 257782, 257783, H01L 2348

Patent

active

058443207

ABSTRACT:
A semiconductor unit, in which a semiconductor device having protruding electrodes is mounted face down onto the terminal electrodes of a circuit board through a bonding layer made of at least two kinds of conductive adhesive, and a method for manufacturing the semiconductor unit.

REFERENCES:
patent: 5436503 (1995-07-01), Kunitomo et al.
Jan. 15, 1980 "IC KA Jissou Gijutsu", edited by Japan Microelectronics Association, published by Institute for Industrial Research, pp. 80-85. (with English asbstract).

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