Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-11-17
1998-12-01
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257723, 257710, H01L 2334
Patent
active
058443118
ABSTRACT:
There is disclosed a multichip module having a sealing-cooling structure which achieves a high packaging density, high sealing-connection reliability, a low manufacturing cost and a high cooling ability. A frame 15, conforming in thermal expansion coefficient to a substrate 11, is soldered at one surface thereof to that surface of the substrate 11 on which semiconductor devices 12 are mounted. The frame 15 is fastened or fixedly secured at the other surface thereof to a lid member 17 by bolts 10 or means without any heat treatment of the whole of the module.
REFERENCES:
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patent: 4975766 (1990-12-01), Umezaw
patent: 5276289 (1994-01-01), Sadoh et al.
patent: 5329160 (1994-07-01), Miura et al.
patent: 5455457 (1995-10-01), Kurokawa
IBM Hournal of Research and Development, vol. 35, No. 3, May, 1991, "IBM System/390 Air-Cooled Alumina Thermal Conduction Module", J. Knickerbocker et al, pp. 330-340.
Hidaka Hiroyuki
Kasai Kenichi
Netsu Tositada
Tamura Mitsunori
Watanabe Hideki
Chaudhuri Olik
Hitachi , Ltd.
Kelley Nathan K.
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