Molded ring integrated circuit package

Details Molded ring integrated circuit package Molded ring integrated circuit package

1992-03-02

1993-01-05

Thompson, Gregory D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

174 163, 361388, 361421, 361386, 257676, 257681, H05H 720

Patent

active

051776693

ABSTRACT:
An integrated circuit package (10) is formed to reveal the active circuitry (15) on the die surface. An integrated circuit die (12) is mounted on a die mounting portion (32) of a metal lead frame (30) in such a manner that the die is supported on the lead frame by the perimeter portion of the die. The active circuitry (15) on the die is connected to the various metal frame leads (33) by wire bonds (18) between the bond pads on the die and the metal lead frame. Plastic molding material (50) is then molded to encapsulate the wire bond pads (17), the perimeter of the integrated circuit die (16), the wire bonds (18), a portion of the leads (33), the perimeter portion of the back of the die (22), and the lead frame die mounting portion (32). The plastic material is formed so as to expose the active circuitry on the face of the die and a central portion on the back of the die.

REFERENCES:
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4303934 (1981-01-01), Stitt
patent: 5012386 (1991-04-01), McShane et al.

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