Method for electrically conductive metal-to-metal bonding

Details Method for electrically conductive metal-to-metal bonding Method for electrically conductive metal-to-metal bonding

1995-12-01

1997-04-08

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228193, 228208, 438683, H01L 2150

Patent

active

056179910

ABSTRACT:
Disclosed herein is a method for electrically conductive metal-to-metal bonding. The method for bonding flat metal surfaces comprises the steps of depositing a thin layer of titanium on a first surface of a first metal surface, placing the first surface of the first metal surface in contact with a first surface of a second metal surface in an inert ambiance, heating the inert ambiance to a temperature substantially below the melting point of the metal surfaces, and forming a titanium metal bond between the first metal surface and the second metal surface to provide a low resistive path between the first metal surface and the second metal surface.

REFERENCES:
patent: 4244002 (1981-01-01), Sato et al.
patent: 5134460 (1992-07-01), Brady et al.

Affiliated with

Also associated with

Rating

Method for electrically conductive metal-to-metal bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for electrically conductive metal-to-metal bonding, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for electrically conductive metal-to-metal bonding will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2393523