Photosensitive resin composition for forming a polyimide film pa

Details Photosensitive resin composition for forming a polyimide film pa Photosensitive resin composition for forming a polyimide film pa

1991-07-05

1993-01-05

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

525431, 522134, 522148, 522 35, 522905, 528 25, G03C 1492, C08F 250, C08L 7700, C08L 8300

Patent

active

051769824

ABSTRACT:
Disclosed is a photosensitive resin composition for forming a polyimide film pattern. The composition contains a polyamic acid and at least one silyl ketone compound represented by general formula (II) given below, ##STR1## where each of R.sup.3 to R.sup.16 is a are substituted or unsubstituted alkyl group having 1 to 12 carbon atoms or a substituted or unsubstituted aromatic group having 6 to 14 carbon atoms, each of R.sup.5 to R.sup.16 may be a substituted or unsubstituted silyl group, and each of l, m, n, s, t and u is 0 or 1, at least one of l, m, n, s, t and u being 1. The composition further contains a sensitizer, as required. A semiconductor substrate is coated with the composition, followed by exposing the coating through a predetermined mask and subsequently developing and heat-treating the coating so as to form a polyimide film pattern.

REFERENCES:
patent: 4321319 (1982-03-01), Shoji et al.
patent: 4406764 (1983-09-01), Hayase et al.
patent: 4437959 (1984-03-01), Hayase et al.
patent: 4599155 (1986-07-01), Suzuki et al.
patent: 4698295 (1987-10-01), Pfeifer et al.
patent: 4865949 (1989-09-01), Yamamura et al.
patent: 4898806 (1990-02-01), Pfeifer
World Patent Index Latest, Week 9015, Derwent Publications Ltd., London, GB; AN90-110550 & JP-A-2 059 752 (Toshiba K.K.)"abstract".
Polymer Preprints, Japan, vol. 39, No. 3, (1990), p. 802.

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