Method for depositing material on depressions

Details Method for depositing material on depressions Method for depositing material on depressions

1990-08-14

1993-01-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156651, 156657, 1566591, 156662, 427586, 437228, H01L 21306, B44C 122, C03C 1500, B05D 306

Patent

active

051767899

ABSTRACT:
An improved capacitor for a semiconductor memory, and method for depositing material on a substrate is shown. The material to be deposited is energized by irradiation with light in a chamber in which a CVD method is carried out. The energy induced by the irradiation remains in the molecules of the material even after the molecules have lain on the substrate. With the residual energy, the molecules can wander on the substrate even to a hidden surface. Due to this wandering, the deposition can be performed also on the inside of a deep cave.

REFERENCES:
patent: 4472240 (1984-09-01), Kameyama
patent: 4645564 (1987-02-01), Morie et al.
patent: 4685198 (1987-08-01), Kawakita et al.
patent: 4735821 (1988-04-01), Yamazaki et al.
patent: 4845048 (1989-07-01), Tamaki et al.
patent: 4861622 (1989-08-01), Yamazaki et al.

Affiliated with

Also associated with

Rating

Method for depositing material on depressions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for depositing material on depressions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for depositing material on depressions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2389355