Method for etching silicon compound film and process for forming

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156646, 156630, 156653, H01L 21306

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active

053743326

ABSTRACT:
A method for etching a silicon compound film comprises etching the silicon compound film in a gas flow rate ratio of CHF.sub.3 to C.sub.2 F.sub.6 of 1 to 6 under etching pressure of 40 to 120 Pa.

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