Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1997-12-09
1999-12-28
Niebling, John F.
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438724, 438743, 438744, 438637, 438638, 438639, 438640, 438672, 438675, H01L 21302
Patent
active
060081368
ABSTRACT:
In a method for manufacturing a semiconductor device, an insulating layer is formed on a refractory metal layer, and a contact hole in the insulating layer by a dry etching process using an etching gas includes one of:
a mixture gas of fluorocarbon and hydrogen;
a mixture gas of hydrofluorocarbon and hydrogen;
a gas of hydrofluorocarbon; and
a fluorocarbon gas except for CF.sub.4.
REFERENCES:
patent: 4522681 (1985-06-01), Gorowitz et al.
patent: 4582563 (1986-04-01), Hazuki et al.
patent: 5702982 (1997-12-01), Lee et al.
NEC Corporation
Niebling John F.
Zarneke David A
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