Apparatus for molding resin to seal electronic parts

Details Apparatus for molding resin to seal electronic parts Apparatus for molding resin to seal electronic parts

1997-11-25

1999-12-28

Davis, Robert

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

4251261, 425226, 425233, 425192R, 425193, 425574, 425588, 425444, 425DIG201, B29C 3108, B29C 4502, B29C 4542, B29C 4518

Patent

active

060073160

ABSTRACT:
A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.

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