Method of fabricating asymmetric closely-spaced multiple diode l

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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437209, 437902, 437906, 148DIG95, H01L 21306, H01L 2160

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active

053243870

ABSTRACT:
The present invention is a method for fabricating a multiple beam semiconductor laser, wherein the laser includes first and second semiconductor laser dies respectively affixed to a pair of supporting heatsinks. The method utilizes a laminating process to accurately position the supporting heatsinks relative to one another yet on opposite sides of an intermediate spacer to form a sandwich-like element. After permanently affixing the sandwich-like element to a base plate, the intermediate spacer is dissolved or otherwise removed to expose the mounting surfaces for the laser dies. The method not only enables the accurate placement of the heatsinks relative to one another so as to reduce the positional error, but also eliminates the need for subsequent multiple-step laser beam alignment operations.

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