Masking agent for the deposition of a material and method for su

Details Masking agent for the deposition of a material and method for su Masking agent for the deposition of a material and method for su

1980-03-19

1981-12-22

Martin, Jr., Roland E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430324, 430329, G03C 500

Patent

active

043071813

ABSTRACT:
To prepare a masking agent resistant to temperature, one adds silica powder to a photoresist. The mixture thus obtained is used to produce selective deposition of a layer of material on a substrate. The mixture of photoresist and silica powder serves as a photo-sensitive protective material which is then eliminated partially by selective exposure to light and use of a photographic developer. The temperatures involved in the deposition of the layer of desired material, for instance tin oxide, are about 500.degree. C. (deposition in the vapor phase), and the photo-sensitive material would be liable to destruction if it did not contain silica powder. It is then necessary, once the deposition of the desired material has been effected, to increase the temperature of the workpiece up to about 540.degree. C. to destroy and, hence, to eliminate the protective material.

REFERENCES:
patent: 3754920 (1973-08-01), Kuchta
patent: 3982941 (1976-09-01), Inskip
patent: 4042390 (1977-08-01), Steele
IBM Technical Disclosure Bulletin, vol. 15, No. 3, Aug. 1972, "Screenable Photoresist", Best et al.

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