Method of bonding copper and resin

Details Method of bonding copper and resin Method of bonding copper and resin

1986-01-27

1987-02-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156656, 156666, 156902, 1563077, 156314, 427 96, C23F 102, B44C 122, B31B 3126

Patent

active

046421610

ABSTRACT:
A method of bonding copper and a resin together is disclosed which comprises forming a copper oxide layer on the surface of copper to be bonded to a resin, reducing the copper oxide layer to metallic copper with a reducing solution, and bonding the metallic copper and the resin together. According to this method, a good acid resistance of the bonding interface and a sufficiently high bonding strength can be obtained.

REFERENCES:
patent: 2291592 (1942-07-01), Dowling
patent: 3728178 (1973-04-01), Caule
patent: 4247589 (1981-01-01), Greenspan
patent: 4316942 (1982-02-01), Kuo
patent: 4358479 (1982-11-01), Canestaro et al.
patent: 4387137 (1983-01-01), Rice
patent: 4409037 (1983-10-01), Landau

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