Process for forming via holes having sloped walls

Details Process for forming via holes having sloped walls Process for forming via holes having sloped walls

1984-05-21

1984-11-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156646, 156655, 156668, 204192E, B44C 122, C03C 1500, C03C 2506, B29C 1708

Patent

active

044824270

ABSTRACT:
A dry process for forming via holes with sloped walls by oxygen reactive ion etching through a perforated mask.

REFERENCES:
patent: 4357203 (1982-11-01), Zelez
Bondur and Clark, "Plasma Etching for SiO.sub.2 Profile Control", Solid State Technology, pp. 122, Apr. 1980.

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