Method for etching copper and composition useful therein

Details Method for etching copper and composition useful therein Method for etching copper and composition useful therein

1985-06-20

1987-01-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156666, 156902, 252 792, 252 794, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

046362827

ABSTRACT:
A composition of matter comprising sulfuric acid and guanidine, aminoguanidine, or formylated aminoguanidine. The composition is useful in the preparation of sulfuric acid/hydrogen peroxide etching solutions and in methods for etching copper, most particularly in the manufacture of printed circuits.

REFERENCES:
patent: 2694001 (1954-11-01), Hayes
patent: 3328303 (1967-06-01), Mahnkopf et al.
patent: 3463733 (1969-08-01), Achenbach
patent: 3668131 (1972-06-01), Banush et al.
patent: 3801512 (1974-04-01), Solenberger
patent: 4130454 (1978-12-01), Dutkewych et al.

Affiliated with

Also associated with

Rating

Method for etching copper and composition useful therein does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for etching copper and composition useful therein, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for etching copper and composition useful therein will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2354272