Method of forming wirings

Details Method of forming wirings Method of forming wirings

1997-11-21

2000-04-18

Tsai, Jey

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438622, 438625, 438629, 438637, 438643, 438648, 438653, 438656, 438660, 438663, 438688, H01L 214763

Patent

active

060514906

ABSTRACT:
A method of forming wirings which includes forming a film of a silicon-containing metal layer at a high temperature on an underlying metal, thereby forming a silicon alloy layer which includes the underlying metal and the silicon-containing metal during film formation. In a case of forming wirings by a silicon-containing metal layer, occurrence of Si nodules can be eliminated to obtain wirings of high reliability.

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