Stacked semiconductor package having supporting bars and a socke

Details Stacked semiconductor package having supporting bars and a socke Stacked semiconductor package having supporting bars and a socke

1995-11-09

1998-01-06

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 257686, 257668, 257685, 257353, 257724, 439 69, H05K 100, H01L 2700

Patent

active

057061726

ABSTRACT:
A stacked semiconductor package including a plurality of semiconductor devices stacked over one another and having outer leads, which are extended from sides of the devices and bent downwardly. A plurality of supports are vertically interposed between the outer leads. The supports electrically connect the outer leads in vertical direction only.

REFERENCES:
patent: 4398235 (1983-08-01), Lutz et al.
patent: 4956694 (1990-09-01), Eide
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5247423 (1993-09-01), Lin et al.
patent: 5343075 (1994-08-01), Nishino
patent: 5481133 (1996-01-01), Hsu
patent: 5602420 (1997-02-01), Ogata et al.
patent: 5613033 (1997-03-01), Swamy et al.

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