Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1994-06-30
1996-01-02
Tung, T.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566261, 324445, 324453, G01N 2702, H01L 21306
Patent
active
054805112
ABSTRACT:
A contactless method and apparatus for in-situ chemical etch monitoring of an etching process during etching of a workpiece with a wet chemical etchant are disclosed. The method comprises steps of providing at least two toroidal windings in the wet chemical etchant to be proximate to but not in contact with the workpiece; and monitoring an electrical characteristic between said at least two toroidal windings, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process. Such a method and apparatus are particularly useful in a wet chemical etch station.
REFERENCES:
patent: 2933675 (1960-04-01), Hoelzle
patent: 3163568 (1964-12-01), Le Mieux
patent: 3292077 (1966-12-01), Sloughter
patent: 3553052 (1972-01-01), Jubb, Jr.
patent: 3806798 (1974-04-01), Gross
patent: 3874959 (1975-04-01), Hoekstra et al.
patent: 3959046 (1976-05-01), Bussmann et al.
patent: 3964956 (1976-06-01), Snyder
patent: 4207137 (1980-06-01), Tretola
patent: 4338157 (1982-07-01), Kanda
patent: 4497699 (1985-02-01), de Wit et al.
patent: 4621037 (1986-11-01), Kanda et al.
patent: 4755442 (1988-07-01), Hasebe et al.
patent: 4767496 (1988-08-01), Hieber
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4954212 (1990-09-01), Gabriel
patent: 4969973 (1990-11-01), Rinck et al.
patent: 4995939 (1991-02-01), Ferenczi et al.
patent: 5071508 (1991-12-01), Scheithauer et al.
patent: 5081421 (1992-01-01), Miller et al.
patent: 5198072 (1993-03-01), Gabriel
patent: 5338390 (1994-08-01), Barbee et al.
Goubau, W. M., "Capacitive Etch Rate Monitor for Dielectric Etching", IBM Technical Disc. Bulletin vol. 31, No. 1, Jun. 1988, 448-449.
Liu et al., "Resistance/Capacitance Methods for Determining Oxide Etch End Point", IBM Technical Disc. Bulletin vol. 16, No. 8, Jan. 1974, 2706-2707.
Hoekstra, J. P., "Establishing End Point During Delineation Process", IBM Technical Disc. Bulletin vol. 16, No. 6, Nov. 1973, 1717-1720.
Bassous et al., "An In-Situ Etch Rate Monitor Controller", IBM Technical Disc. Bulletin vol. 20, No. 3, Aug. 1977, 1232-1234.
Barbee Steven G.
Heinz Tony F.
Li Leping
Ratzlaff Eugene H.
Balconi-Lamica Michael J.
International Business Machines - Corporation
Mortinger Alison D.
Tung T.
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