Method of minimizing surface effects in thin ferroelectrics

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C23L 1400

Patent

active

057050414

ABSTRACT:
A method of improving the responsivity of a pyroelectric device including providing a pyroelectric element of less than maximum theoretical density having holes therein extending to a surface of the element and having contaminants at the surface (22), cleaning the contaminants from the surface and metallizing the surface prior to contaminant reformation on the surface. The pyroelectric element is preferably a ferroelectric element and preferably barium strontium titanate. The step of cleaning can be by oxygen plasma, acid etch or a combination thereof. When the combination of cleaning steps is used, the step of cleaning comprises etching the surface and then oxygen cleaning the surface.

REFERENCES:
patent: 5578867 (1996-11-01), Argos, Jr. et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of minimizing surface effects in thin ferroelectrics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of minimizing surface effects in thin ferroelectrics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of minimizing surface effects in thin ferroelectrics will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2325777

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.