Method and apparatus for endpoint detection in a chemical/mechan

Details Method and apparatus for endpoint detection in a chemical/mechan Method and apparatus for endpoint detection in a chemical/mechan

Filed on

1994-11-30

Date issued

1997-01-21

Examiner

Rose, Robert A.

Patent Class

Abrading

SubClass

Precision device or process - or with condition responsive...

SubSubClass

With indicating

Other Related Categories

451 5, 451 41, B24B 4900, B24B 1922

Type

Patent

Status

active

Patent number

055955266

Description

ABSTRACT:
A method for polishing the surface of a substrate that overcomes the problems inherent in the prior art. During the polishing of a substrate, a quantity is calculated which is approximately proportional to a share of the total energy the polisher is consuming. Once this calculated quantity reaches a predetermined amount, it is detected.

REFERENCES:
patent: 4351029 (1982-09-01), Maxey et al.
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5071421 (1992-01-01), Miller et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5245794 (1993-09-01), Salugsugan
patent: 5308438 (1994-05-01), Cote et al.
patent: 5337015 (1994-08-01), Lustig et al.

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