Production of semiconductor package having semiconductor chip mo

Details Production of semiconductor package having semiconductor chip mo Production of semiconductor package having semiconductor chip mo

1996-07-03

1998-07-28

Niebling, John

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438613, 438108, 257778, 22827217, H01L 2144

Patent

active

057862710

ABSTRACT:
A semiconductor package has a wiring circuit containing a conductive terminal formed on a first face of a substrate and a flat external connecting terminal electrically connected to the wiring circuit formed on a second face. An electrode pad is formed on a first face of a semiconductor chip. This semiconductor chip is mounted on the substrate with its first face down to oppose the first face of the substrate. A ball bump as a protruded electrode formed on the conductive terminal of the substrate and a ball bump as a protruded electrode formed on the electrode pad of the semiconductor chip are connected by solid phase diffusion. And, a sealing resin layer is formed in the space between the substrate and the semiconductor chip opposed to each other with a second face of the semiconductor chip exposed.

REFERENCES:
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 4902648 (1990-02-01), Ohta et al.
patent: 5123163 (1992-06-01), Ishikawa et al.
patent: 5284796 (1994-02-01), Nakanishi et al.
patent: 5306664 (1994-04-01), Sakura
patent: 5450283 (1995-09-01), Lin et al.
patent: 5536973 (1996-07-01), Yamaji
patent: 5550083 (1996-08-01), Koide et al.
patent: 5550408 (1996-08-01), Kunitomoto et al.
patent: 5551627 (1996-09-01), Leicht et al.
patent: 5578874 (1996-11-01), Kurogi et al.

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