Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-07-11
1990-04-10
Straub, Gary P.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566202, 156DIG70, 156647, 437249, C30B 1500, C30B 1520, C30B 1526
Patent
active
049157744
ABSTRACT:
Method of manufacturing orientated substrate plates from solid semiconductor blocks of the III-V group.
The invention relates to a method of manufacturing to obtain substrate plates prepared to receive integrated semi-conductor circuits of materials of the III-V group obtained by pulling according to Czochralski. These materials having anisotropic properties, upon which the performances of the semiconductor devices depend, it is of major importance to differentiate the crystallographic axes of teach plate with an accuracy higher than half the degree. According to the invention, this differentiation is effected in two steps. The first step consists in the differentiation of the axes from the formation of pulling nucleus. For this purpose, the pulling nucleus is a rectangular parallelepipedon, one edge of which has a facet serving as a recess for fixing the seed crystal the pulling operation. This facet is defined with respect to the characteristic axes of the ingot obtained by pulling and is maintained by respect to these axes and until flats are formed on the ingot. The size of these flats identifying this information till the concretization of the said information by the size of the two flats on the ingot itself. The pulling nucleus thus defined being used a large number of times, the method according to the invention results in a considerably saving of time during the industrial processing of the substrates.
REFERENCES:
patent: 3144357 (1964-08-01), Hulme et al.
patent: 3887404 (1975-06-01), Chane156647
Faust, Jr., J. W., Etching of II-V Intermetallic Compounds; Compound Semiconductors, Preparation of III-V Compounds vol. 1; Rheinhold Publishing Co., New York, NY, 1963; pp. 445-468.
Farges Jean-Pierre
Schiller Claude
Franklin M.
Spain Norman N.
Straub Gary P.
U.S. Philips Corporation
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