Vertical heat treatment apparatus having wafer transfer mechanis

Metal working – Barrier layer or semiconductor device making

Patent

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Details

414404, 414416, 414226, H01L 2168, B65G 6500

Patent

active

051620472

ABSTRACT:
According to this invention, a method of transferring a plurality of semiconductor wafers between a carrier and a support ring type boat comprises the steps of picking up the semiconductor wafer from the carrier on a station by an arm in a substantially horizontal state, positioning the wafer supported by the arm above a support ring of the boat, positioning a receiver below the support ring, moving the receiver upward to a position where a pin of the receiver reaches the arm through an opening of the support ring, lifting the wafer from the arm by the pin, moving the arm backward from the boat, moving the receiver downward to a position where the wafer is transferred from the receiver to the support ring, and then loading the boat into a heat treatment furnace.

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patent: 4611966 (1986-09-01), Johnson
patent: 4699556 (1987-10-01), Foulke
patent: 4750857 (1988-06-01), Kochersperger
patent: 4806057 (1989-02-01), Cay et al.
patent: 4938655 (1990-07-01), Asano
patent: 4938691 (1990-07-01), Ohkase et al.
patent: 5048164 (1991-09-01), Harima et al.

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