Method for controlling a semiconductor manufacturing process by

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36446828, 364490, 702185, 702 84, G06F 1900

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059235535

ABSTRACT:
A method for controlling a semiconductor manufacturing process by failure analysis feedback compares a previous failure analysis result with current real-time process conditions. The method uses the steps of: a) establishing a monitoring data base with abnormal process condition data, the abnormal process condition data being obtained by a correlation between a yield for each manufactured lot and corresponding process conditions for semiconductor equipment when the yield is lowered or semiconductor equipment malfunctions have occurred; b) establishing an equipment data base by obtaining real-time process conditions for on-line semiconductor equipment; c) comparing the real-time process conditions for the on-line semiconductor equipment with the abnormal process conditions of the monitoring data base; and d) stopping the operation of the on-line semiconductor equipment when differences between the real-time and abnormal process conditions fall below a predetermined level.

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patent: 5047947 (1991-09-01), Stump
patent: 5196997 (1993-03-01), Kurtzberg et al.
patent: 5479340 (1995-12-01), Fox et al.
patent: 5526293 (1996-06-01), Mozumder et al.

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