Microelectronic package and fabrication thereof

Details Microelectronic package and fabrication thereof Microelectronic package and fabrication thereof

1997-05-19

1999-07-13

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

257723, 257778, 257787, 438108, 438127, H01L 2348

Patent

active

059230908

ABSTRACT:
An electronic package comprising an integrated circuit chip and a flip chip solder bonded thereto is provided. The integrated circuit chip has circuitry over a major surface thereof and has peripheral wire or tab bond pads surrounding an array of C4 connection pads located over this major surface. A flip chip is solder bonded to the C4 connection pads.

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patent: 5095402 (1992-03-01), Hernandez et al.
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5481133 (1996-01-01), Hsu
patent: 5502667 (1996-03-01), Bertin et al.
patent: 5532512 (1996-07-01), Fillion et al.
patent: 5646828 (1997-07-01), Degani et al.
patent: 5818107 (1998-10-01), Pierson et al.

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