Direct chip connection using demountable flip chip package

Details Direct chip connection using demountable flip chip package Direct chip connection using demountable flip chip package

1994-06-29

1996-06-18

Ledynh, Bot L.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361769, 361770, 257778, 29832, 29842, H05K 710

Patent

active

055284620

ABSTRACT:
The present invention provides an easily reworkable demountable means of electrically interconnecting an integrated circuit die to a substrate. The electrical assembly is comprised of an integrated circuit die having contact areas on a first surface, a substrate having contact areas aligned with the contact areas of the die for providing electrical connection to the integrated circuit die, and a compression means for maintaining the integrated circuit die contacts in electrical communication with the contacts of the substrate. The compression means typically includes a two-part spring system which provides superior electrical contact by causing the curvature of the integrated circuit die to be in the same direction as the curvature of the substrate.

REFERENCES:
patent: 4561011 (1985-12-01), Kohara et al.
patent: 5019940 (1991-05-01), Clemens
patent: 5089936 (1992-02-01), Kojima et al.
Ken Gilleo, "Direct Chip Interconnect Using Polymer Bonding", IEEE, 1989 pp. 37-49.
Ken Smith, "An Inexpensive High Frequency, High Power, VLSI Chip Carrier", IEEE, 1985 Custom Integrated Circuits Conference, pp. 42-45.
Nagesh R. Basavanhally, David D. Chang, Benjamin H. Cranston and Steven G. Seger, Jr., "Direct Chip Interconnect with Adhesive-Connector Films", 1992, IEEE, pp. 487-491.
Kenzo Hatada, et al.: A New LSI Bonding Technology "Micron Bump Bonding Assembly Technology", IEEE-CHMT Proceedings, 1988, pp. 23-27.

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