Perimeter matrix ball grid array circuit package with a populate

Details Perimeter matrix ball grid array circuit package with a populate Perimeter matrix ball grid array circuit package with a populate

1997-10-24

1999-04-13

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361772, 361777, 361783, 361820, 257778, 257724, 257730, 257780, H05K 01011

Patent

active

058944109

ABSTRACT:
A ball grid array (BGA) integrated circuit package which has an outer two-dimensional array of solder balls and a center two-dimensional array of solder balls located on a bottom surface of a package substrate. The solder balls are typically reflowed to mount the package to a printed circuit board. Mounted to an opposite surface of the substrate is an integrated circuit that is electrically coupled to the solder balls by internal routing within the package. The outer array of solder balls are located the dimensional profile of the integrated circuit to reduce solder stresses induced by the differential thermal expansion between the integrated circuit and the substrate. The center solder balls are typically routed directly to ground and power pads of the package to provide a direct thermal and electrical path from the integrated circuit to the printed circuit board.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5450283 (1995-09-01), Lin et al.
patent: 5490324 (1996-02-01), Newman

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