Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1989-12-19
1992-03-31
Hamilton, Cynthia
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
522100, 522103, G03F 7004, G03F 7039
Patent
active
051007673
ABSTRACT:
The present invention provides a photopolymerizable composition useful as a liquid photoimageable solder mask comprising (a) a reaction product obtained by reacting epoxy resin A containing at least two terminated epoxy groups with 0.8 to 1.2 mol, per 1 epoxy equivalent of epoxy resin A, of an .alpha.,.beta.-unsaturated carboxylic acid and then reacting same with 0.2 to 1.0 mol, per 1 epoxy equivalent of epoxy resin A, of polybasic acid anhydride, (b) diluent, (c) sensitizer, (d) epoxy resin B consisting of tris (2,3-epoxypropyl) isocyanurate whose melting point is 130.degree. C. or less, and (e) an epoxy resin curing agent represented by the general formula [I:] ##STR1## wherein R is --H, halogen, --NH.sub.2, --SH, aromatic hydrocarbon, a C.sub.1 -C.sub.4 alkyl group or NHR' (R' is a C.sub.1 -C.sub.4 alkyl group having --CN or NH.sub.2 C.dbd.NH).
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Santo Shinji
Yanagawa Makoto
Hamilton Cynthia
Tamura Kaken Co., Ltd.
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