Method of forming fine patterns

Details Method of forming fine patterns Method of forming fine patterns

1990-10-23

1992-03-31

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566611, 156904, 430312, 430318, B44C 122, C23F 102

Patent

active

051005085

ABSTRACT:
Disclosed is a method of forming a fine pattern composed by repeating, at least once or more, a series of fine pattern forming process having the steps of coating a photoresist on a wafer, exposing a predetermined portion of the wafer through a reticle, carrying out a developing process after the exposure process, etching the wafer, and removing a resist remaining on the wafer, wherein different portions on the wafer are respectively exposed in the exposing process in the series of fine pattern forming process, and each portion once exposed in the process is not exposed again.

REFERENCES:
patent: 3607267 (1971-09-01), Garrels
patent: 3615463 (1971-10-01), Kuschell

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