Method for bonding a heat sink to a die paddle

Details Method for bonding a heat sink to a die paddle Method for bonding a heat sink to a die paddle

1996-01-31

1997-09-30

Niebling, John

Fishing, trapping, and vermin destroying

437220, 437902, H01L 2160, H01L 2348

Patent

active

056725477

ABSTRACT:
A method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture therethrough, positioning a heat sink abutting the bottom surface of the die paddle portion, and then pressing an integrated circuit die against the top surface of the die paddle portion with an adhesive material sandwiched therein between such that the adhesive flows through at least one aperture in the die paddle portion to bond the integrated circuit die and the heat sink together.

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patent: 4918511 (1990-04-01), Brown
patent: 5139973 (1992-08-01), Nagy et al.
patent: 5202288 (1993-04-01), Doering et al.
patent: 5208188 (1993-05-01), Newman
patent: 5378656 (1995-01-01), Kajihara et al.
patent: 5387554 (1995-02-01), Liang
patent: 5429992 (1995-07-01), Abbott et al.
patent: 5441918 (1995-08-01), Morisaki et al.
patent: 5444602 (1995-08-01), Banerjee et al.

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