Integrated semiconductor wafer processing system

Details Integrated semiconductor wafer processing system Integrated semiconductor wafer processing system

1995-05-10

1997-09-30

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 20429835, H01L 2130

Patent

active

056722397

ABSTRACT:
An improved apparatus and method which offers an integral pre-strip rinse operation between etching operation and stripping operation. The present invention is designed to allow a semiconductor wafer to undergo sequential processing of dry etching, wet pre-strip rinsing, dry photoresist stripping, and wet final rinsing in a single system.

REFERENCES:
patent: 5135608 (1992-08-01), Okutani
patent: 5171393 (1992-12-01), Moffat
patent: 5376212 (1994-12-01), Saiki

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