Film carrier and a method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

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257666, 257668, H01L 23495

Patent

active

055280781

ABSTRACT:
A film carrier for a semiconductor chip comprises a film having a device hole formed therein for mounting said film carrier to the semiconductor chip, and a plurality of leads. Each lead has an end portion thereof extending into the device hole in the film, and the end portion of the leads include an anodic oxide layer disposed therein and a contact portion for contacting an electrode pad of the semiconductor chip.

REFERENCES:
patent: 4594493 (1986-06-01), Harrah et al.
patent: 5132772 (1992-07-01), Fetty
patent: 5153707 (1992-10-01), Makino et al.
patent: 5248895 (1993-09-01), Nakazawa
patent: 5252855 (1993-10-01), Ogawa et al.
patent: 5311056 (1994-05-01), Wakabayashi et al.

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