Process for manufacture of integrated circuit device

Details Process for manufacture of integrated circuit device Process for manufacture of integrated circuit device

1996-12-19

1999-04-20

Bowers, Charles

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438624, 438623, 438781, 438790, 438633, H01L 2128

Patent

active

058952632

ABSTRACT:
The invention relates to a process for forming an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises porous organic polysilica.

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