Method for forming electric circuits on a base board

Details Method for forming electric circuits on a base board Method for forming electric circuits on a base board

1986-12-29

1988-04-05

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29620, 29852, 156634, 156645, 156656, 1566611, 156902, 204 384, 204 15, 338308, 427 97, 427102, 427103, C23F 102, B44C 122, B05D 512, C25D 500

Patent

active

047356766

ABSTRACT:
A method for forming a plurality of electrically conductive circuits of at least four laminations on a single base board having copper laminations attached on both sides thereof, for example, wherein the base board is processed to provide a through-hole therein, subjected to a catalyst treatment, etched to provide a plurality of circuits of a first lamination, effectively processed with a plating-resistant resist and an electrically conductive copper paste to provide a circuit of a second lamination on the circuits of the first lamination by making a pre-plating treatment and a subsequent chemical treatment applied to the copper paste. The base board is then coated again with the plating-resistant resist except a part of the circuits of the first lamination formed around the through-hole, subjected to an activation treatment and then to a nonelectrolytic copper plating applied to the inner periphery of the through-hole to provide thereon a copper plating layer for electrically connecting the circuits of the first lamination on both sides of the base board.

REFERENCES:
patent: 4211603 (1980-07-01), Reed
patent: 4424095 (1984-01-01), Frisch et al.
patent: 4512829 (1985-04-01), Ohta et al.

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