Method and device of testing semiconductor integrated circuit ch

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324760, 324752, G01R 3126

Patent

active

060723270

ABSTRACT:
While an ultrasonic wave beam producing device scans an ultrasonic wave beam 5 across a semiconductor integrated circuit chip 2, a current through the circuit chip is detected. In this way, the semiconductor integrated circuit chip may be accurately tested, and the creation of electron-hole pairs is avoided.

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