Method of forming thin metal films

Details Method of forming thin metal films Method of forming thin metal films

1996-11-20

2000-09-05

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

20429812, C23C 1434

Patent

active

061137502

ABSTRACT:
Formation of metal thin films by collimate sputtering with high productivity and high bottom coverages. The bottom coverages by collimate sputtering are increased by using a target having a high sputtered-particle emission probability in the range of angles at which the collimator passage rate is high, without increasing the aspect ratio of the collimator, that is, without lowering the productivity.

REFERENCES:
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patent: 5529670 (1996-06-01), Ryan et al.
patent: 5607899 (1997-03-01), Yoshida et al.
patent: 5635036 (1997-06-01), Demaray et al.
patent: 5643422 (1997-07-01), Yamada
patent: 5711858 (1998-01-01), Kontra et al.
patent: 5772860 (1998-06-01), Sawada et al.

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